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Preparing Additive Printed Circuits

IP.com Disclosure Number: IPCOM000092945D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Levy, MF: AUTHOR

Abstract

A printed circuit is prepared on an organic polymeric substrate. The substrate is exposed to ionizing radiation in a predetermined pattern. Exposure can take place either under a vacuum or in a nitrogen atmosphere. After exposure to the radiation, which leaves a pattern of free radicals on the substrate's surface, the substrate is immersed in liquid acrylonitrile monomer. Alternately, the substrate can be exposed to vapors of the monomer. Graft polymerization of the acrylonitrile monomer occurs at the irradiated sites. The grafted polyacrylonitrile is then pyrolyzed by exposing it to a heat source having a temperature of about 230 degrees C. A conductive carbonaceous deposit results which can be made more conductive by both electrolessly and electrically plating, or either alone, a metal on it.

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Preparing Additive Printed Circuits

A printed circuit is prepared on an organic polymeric substrate. The substrate is exposed to ionizing radiation in a predetermined pattern. Exposure can take place either under a vacuum or in a nitrogen atmosphere. After exposure to the radiation, which leaves a pattern of free radicals on the substrate's surface, the substrate is immersed in liquid acrylonitrile monomer. Alternately, the substrate can be exposed to vapors of the monomer. Graft polymerization of the acrylonitrile monomer occurs at the irradiated sites. The grafted polyacrylonitrile is then pyrolyzed by exposing it to a heat source having a temperature of about 230 degrees C. A conductive carbonaceous deposit results which can be made more conductive by both electrolessly and electrically plating, or either alone, a metal on it.

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