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Metal Plating of Pyrolyzate Circuitry

IP.com Disclosure Number: IPCOM000092946D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Saunders, TF: AUTHOR [+3]

Abstract

Printed circuits are prepared by metalplating a conductive carbonaceous pattern. A substrate coated with an organic polymer is exposed to radiant energy in a predetermined pattern. The organic coating is prolyzed by the radiant energy producing a conductive carbonaceous pattern. The substrate, with its conductive pattern, is immersed in a sensitizing bath, e. g., an aqueous solution of palladium chloride, to adsorb sensitizer on the conductive pattern. Rinsing in deionized water follows to remove the sensitizer from the unpyrolyzed portions of the substrate. The sensitized conductive pattern is baked in an oven at about 120 degrees C for about 30 minutes to remove residual moisture and to increase adsorption of the sensitizer to the conductive pattern.

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Metal Plating of Pyrolyzate Circuitry

Printed circuits are prepared by metalplating a conductive carbonaceous pattern. A substrate coated with an organic polymer is exposed to radiant energy in a predetermined pattern. The organic coating is prolyzed by the radiant energy producing a conductive carbonaceous pattern. The substrate, with its conductive pattern, is immersed in a sensitizing bath, e. g., an aqueous solution of palladium chloride, to adsorb sensitizer on the conductive pattern. Rinsing in deionized water follows to remove the sensitizer from the unpyrolyzed portions of the substrate. The sensitized conductive pattern is baked in an oven at about 120 degrees C for about 30 minutes to remove residual moisture and to increase adsorption of the sensitizer to the conductive pattern. After about 120 degrees C for about 30 minutes to remove residual moisture and to increase adsorption of the sensitizer to the conductive pattern. After subsequent cooling of the substrate, it is immersed in an electroless copper plating bath for a time sufficient to achieve an optimum copper film thickness on the conductive pattern. The copper film thickness can be increased by electroplating techniques.

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