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Technique for Forming Electrical Sockets

IP.com Disclosure Number: IPCOM000092971D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Copeletti, TJ: AUTHOR

Abstract

Electrical sockets of any size and pin configuration can be fixed in a plastic matrix by this technique. The latter is particularly useful in forming trimmer and test sockets regardless of size and pin layout. A low melting wax is melted and maintained molten in a small container on a hotplate. The plug socket pins are put onto the pinned substrate and positioned so that the desired distance is maintained between the substrate and socket pins. The latter should be of the desired size required to fit the substrate pins. The number of the socket pins is dictated by the number of the pins in the substrate.

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Technique for Forming Electrical Sockets

Electrical sockets of any size and pin configuration can be fixed in a plastic matrix by this technique. The latter is particularly useful in forming trimmer and test sockets regardless of size and pin layout. A low melting wax is melted and maintained molten in a small container on a hotplate. The plug socket pins are put onto the pinned substrate and positioned so that the desired distance is maintained between the substrate and socket pins. The latter should be of the desired size required to fit the substrate pins. The number of the socket pins is dictated by the number of the pins in the substrate.

Using a small container as mold 1, pinned substrate 2 including socket pins 3 is placed in the center of the mold with pins 4 facing up. Hot wax is then dispensed into mold 1 until the wax level reaches a point just above the vertical slot in pins 3. The wax level is reduced from level A to level B by removal. This step leaves a coating of wax on the surface of pins 3 between levels A and B. The wax is then allowed to cool until it is solidified. A suitable plastic potting compound is mixed and warmed to release air bubbles.

This compound is then dispensed into mold 1 containing the solidified wax to a level C which is even with the last shoulder of pins 3. The potting compound is then cured at an elevated temperature for the desired period of time. The socket can be removed from mold 1 after the cure of the potting compoun...