Browse Prior Art Database

Monolithic Chip Carrier

IP.com Disclosure Number: IPCOM000092975D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 34K

Publishing Venue

IBM

Related People

Betz, RJ: AUTHOR [+2]

Abstract

This carrier is a hermetically sealed package for a monolithic chip. Bas e 10 is a metallic element which supports glass frame 12. Mounted on top of frame 12 and insulated by such frame from base 10 is a number of metal contacts 14 which extend radially out from the square package. Base 10, frame 12, and contacts 14 are fused together in a first firing to form an integral unit.

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Monolithic Chip Carrier

This carrier is a hermetically sealed package for a monolithic chip. Bas e 10 is a metallic element which supports glass frame 12. Mounted on top of frame 12 and insulated by such frame from base 10 is a number of metal contacts 14 which extend radially out from the square package. Base 10, frame 12, and contacts 14 are fused together in a first firing to form an integral unit.

Monolithic chip 16 is electrically connected to each metal lead 14 by a ball
18. Leads 14 are tinned and then such leads and balls 18 are aligned and brought together at a suitable pressure and temperature to make the electrical connections.

Positioned on top of leads 14 is glass frame 20 and metal frame 22. Frames 20 and 22 are fused together and to glass frame 12 in a second fusing. Cap 24 is seam-welded to the top of frame 22 under vacuum to obtain a hermetic seal.

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