Browse Prior Art Database

Hybrid Circuit Package

IP.com Disclosure Number: IPCOM000092979D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 91K

Publishing Venue

IBM

Related People

McConaghy, BW: AUTHOR [+3]

Abstract

Monolithic, discrete, and thin-film components are mounted individually or in any combination in a hermetically sealed package using two substrates which provide three surfaces for component mounting. The structure has the advantage that interlevel electrical connections are not made directly to the main pins or leads.

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Hybrid Circuit Package

Monolithic, discrete, and thin-film components are mounted individually or in any combination in a hermetically sealed package using two substrates which provide three surfaces for component mounting. The structure has the advantage that interlevel electrical connections are not made directly to the main pins or leads.

Drawings 1 A and B illustrate one form of the hybrid circuit package which has thirty-two external leads or pins 1 arranged in an array. Substrate 2 has space for thirty-six pins on a 0.125" grid. The thirty-six pin configuration is obtained by dropping 4 pins at the center, leaving a space of 0.300" x 0.300" which can contain one or more monolithic chips 3. It is possible to mount monolithic chips in other areas on the substrate by dropping pins other than the four in the center. Where the chip is 0.050" x 0.050" or less, it is not necessary to drop any pins.

Short pins 4 connect substrates 2 and 5. Pins 4 are mounted in holes in substrate 2 and pass completely through openings in substrate 5. Interconnections between substrates 2 and 5 can alternatively be made using a lead frame instead of use of pins 4 as shown. Chip 3 is connected to the pins by flying leads 6. However, using a lead frame can also serve this purpose. Leads 6 of chip 3 are connected between the chip and the substrate by any suitable conventional technique such as ultrasonic bonding, thermocompression bonding or soldering, depending upon the desired materi...