Browse Prior Art Database

Assembly of Circuit Cards through the Use of Tape Adhesives

IP.com Disclosure Number: IPCOM000093039D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Pena, AS: AUTHOR [+2]

Abstract

This process is utilized in the assembly of circuit cards. A water-soluble tape with an adhesive coating on both sides can be applied to the component side of a circuit card. Then the electrical components are held in predetermined positions when forced through the adhesive-coated tape and the components are seated against the tape. The tape holds the components to the card during the fluxing, soldering, and other handling operations.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 99% of the total text.

Page 1 of 1

Assembly of Circuit Cards through the Use of Tape Adhesives

This process is utilized in the assembly of circuit cards.

A water-soluble tape with an adhesive coating on both sides can be applied to the component side of a circuit card. Then the electrical components are held in predetermined positions when forced through the adhesive-coated tape and the components are seated against the tape. The tape holds the components to the card during the fluxing, soldering, and other handling operations.

After the soldering operation is completed, the water-soluble tape is washed away from the circuit card through the use of hot water. Suitable tape dissolves in water having a temperature between 100 degrees and 140 degrees F, with the dissolution accelerated if the water is agitated. A water spray rinse facilitates the tape removal. The exact times of circuit card immersion in water and the water spraying operation are adjusted to conform with applications and circuit card assemblies.

The tape's solubility allows the use of water-soluble flux which can be removed at the same time as the tape is being removed. The tape acts as a barrier for the flux on the component side of circuit cards. The amount of flux which comes in contact with the card surface is reduced. The card quality in terms of chloride residue is improved. Another advantage is that the leads do not have to be bent in order to hold the component to the circuit card prior to the soldering operations, thus reduc...