Browse Prior Art Database

Monolithic Circuit Package

IP.com Disclosure Number: IPCOM000093058D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 51K

Publishing Venue

IBM

Related People

Totta, PA: AUTHOR

Abstract

This monolithic circuit package provides multiple electrical connections to one side of the device and a good thermal connection to the other side. The package has improved heat dissipation and is additionally suitable for power transistors.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 53% of the total text.

Page 1 of 2

Monolithic Circuit Package

This monolithic circuit package provides multiple electrical connections to one side of the device and a good thermal connection to the other side. The package has improved heat dissipation and is additionally suitable for power transistors.

In one form, the package comprises monolithic semiconductor chip A with solder pads 20 on one face and blanket, solderable metallurgy 24 on the rear side. Chip A is fastened to intermediate substrate B, typically borosilicate glass with thin-film circuitry 26. The circuitry is covered with sputtered or fired frit insulation 28 and includes solder pad terminals 30. The wiring on substrate B can be multilevel, allowing crossovers and other wiring interconnections. lt can be adapted to accommodate more than one chip A, providing interconnections exist between the chips. Module base C includes pins, clips, or other connectors
32. Conductors are silk screened, plated or evaporated on base C. Aperture 34 is included to accommodate heat transfer element D. The latter is joined to the solder-coated or solderable lands 24 of chip A. Element D can be free-floating, solder-tipped or a metal pin with washer. Alternatively, aperture 34 can be packed with alumina powder or other powders or liquids with good heat transfer characteristics and sealed with a plug not shown. Alternatively, it can be filled with metal powder or spheres and permeated with solder.

The package is assembled by fabricating substrate B on a PYREX* plate. The cir...