Browse Prior Art Database

Selective Electrical Heater System for Module Removal

IP.com Disclosure Number: IPCOM000093067D
Original Publication Date: 1967-Apr-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 2 page(s) / 55K

Publishing Venue

IBM

Related People

Palfi, TL: AUTHOR [+2]

Abstract

To facilitate removal of chip carrier modules, a multilayer insulating substrate containing embedded heater wires is employed. The heater wires are arranged in a crossover matrix and are connected to a power supply via discrete heater terminals. Upon the interception of an addressed unit, solder reflow occurs due to the high heat density at the solder bucket holes of the individual chip cells. Removal from the melted solder is effortless and noninjurious to the devices within the chip carrier and to surrounding carriers within the substrate.

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Selective Electrical Heater System for Module Removal

To facilitate removal of chip carrier modules, a multilayer insulating substrate containing embedded heater wires is employed. The heater wires are arranged in a crossover matrix and are connected to a power supply via discrete heater terminals. Upon the interception of an addressed unit, solder reflow occurs due to the high heat density at the solder bucket holes of the individual chip cells. Removal from the melted solder is effortless and noninjurious to the devices within the chip carrier and to surrounding carriers within the substrate.

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