Browse Prior Art Database

Module Cap Crimping Apparatus

IP.com Disclosure Number: IPCOM000093118D
Original Publication Date: 1967-May-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 78K

Publishing Venue

IBM

Related People

Bradley, JW: AUTHOR [+3]

Abstract

This apparatus secures a module cap to a substrate unit with a series of double crimps which straddle the substrate unit. In the packaging of electronic modules, particularly double layer substrate modules of the type shown in A, the substrate unit must initially be positioned relative to the cap, and the cap and unit firmly secured.

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Module Cap Crimping Apparatus

This apparatus secures a module cap to a substrate unit with a series of double crimps which straddle the substrate unit. In the packaging of electronic modules, particularly double layer substrate modules of the type shown in A, the substrate unit must initially be positioned relative to the cap, and the cap and unit firmly secured.

Module 8 consists of lower and upper substrates 10 and 12, respectively, containing conductive lands, semiconductor elements, etc., joined by terminal pins 16. Cap 18 is secured by spaced crimps or indentations 20, preferably in all four sides of the cap. Crimps 20 straddle lower substrate 10.

The apparatus has a suitable track assembly not shown. Such assembly introduces the uncrimped substrate unit and cap assembly under crimp head 22. The latter includes four slides 24...27, each provided with four crimp elements 28. Slides 24...27 are driven simultaneously by four respective eccentrics 30, each in turn driven by pinions 32 in common engagement with central gear 34, as indicated in C.

The cap and substrate assembly is lifted off the track and moved into head
22. The relative cap and substrate registration is established and the cap is crimped. The resultant crimped module is ejected from the head by ram 34 and plunger 36.

The module engaging surface of ram 34 is provided with support surfaces for both substrate 10 and cap 18. Such surfaces precisely position the substrate unit within the cap. Plunger...