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Powder Sputtering

IP.com Disclosure Number: IPCOM000093123D
Original Publication Date: 1967-May-01
Included in the Prior Art Database: 2005-Mar-05
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Archey, WB: AUTHOR [+3]

Abstract

This procedure extends the usefuIness of RF sputtering techniques. Monolithic films of nonconductors are sputtered from their loose powders by the application of an RF potential. The basic apparatus and process for accomplishing the same are described in an article "Dielectric Thin Films through rf Sputtering" by P. D. Davidse and L. I. Maissel in the February 1966 Journal of Applied Physics, Vol. 37, No. 2, Pages 574-579. By using loose powders, rather than solid material as the target, several advantages are realized. These include the elimination of target fabrication problems, an increase in deposition rates, and a more uniform sputtering plasma.

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Powder Sputtering

This procedure extends the usefuIness of RF sputtering techniques. Monolithic films of nonconductors are sputtered from their loose powders by the application of an RF potential. The basic apparatus and process for accomplishing the same are described in an article "Dielectric Thin Films through rf Sputtering" by P. D. Davidse and L. I. Maissel in the February 1966 Journal of Applied Physics, Vol. 37, No. 2, Pages 574-579. By using loose powders, rather than solid material as the target, several advantages are realized. These include the elimination of target fabrication problems, an increase in deposition rates, and a more uniform sputtering plasma.

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