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Selective Electrodeposition

IP.com Disclosure Number: IPCOM000093143D
Original Publication Date: 1967-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Arnold, AJ: AUTHOR [+5]

Abstract

Selected conductive areas 1 of printed circuit board 2 can be electroplated while protecting other areas of the board 2 or mounted components 3. To accomplish this, a wire 4 is first electrically connected to conductive portions that lead to the areas to be plated. Then, board 2 is partially sandwiched between preformed plastic sheets 5 so as to expose the areas being plated. Sealant 6 is applied to the edges to seal out any electrolyte. Air hose 7 supplies air to the thus formed enclosure. The air is under a slight pressure to prevent electrolyte from leaking into the enclosure. Then, metal is plated on areas 1 by electrolysis. Next the board and enclosure are removed from the electrolyte and dried and the board is removed from the enclosure. The process can also be used to selectively deplate or remove metal.

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Selective Electrodeposition

Selected conductive areas 1 of printed circuit board 2 can be electroplated while protecting other areas of the board 2 or mounted components 3. To accomplish this, a wire 4 is first electrically connected to conductive portions that lead to the areas to be plated. Then, board 2 is partially sandwiched between preformed plastic sheets 5 so as to expose the areas being plated. Sealant 6 is applied to the edges to seal out any electrolyte. Air hose 7 supplies air to the thus formed enclosure. The air is under a slight pressure to prevent electrolyte from leaking into the enclosure. Then, metal is plated on areas 1 by electrolysis. Next the board and enclosure are removed from the electrolyte and dried and the board is removed from the enclosure. The process can also be used to selectively deplate or remove metal.

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