Browse Prior Art Database

Solder Stop for Contact Pin

IP.com Disclosure Number: IPCOM000093146D
Original Publication Date: 1967-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 20K

Publishing Venue

IBM

Related People

Clavez, EW: AUTHOR [+2]

Abstract

This process provides goldplated contact pins, used in circuit board assemblies and the like, with a solder stop. The gold plating on edge A of the contact pin is removed by machine grinding. The pins are then heated in an oven to approximately 400 degrees C for fifteen minutes to provide a nickel oxide barrier which is nonwetting to molten solder. After the pins are thus treated, they are ready for use in board assembly work. The pins are inserted through the appropriate solder rings and flux. The pins are properly located by pushing them through holes in the board until stopped by the heads of the pins. When the soldering heat is applied to the assembled board by placing it in an oven, solder flow to head B of the pin is prevented by the nickel oxide barrier and the nonwetting characteristics.

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Solder Stop for Contact Pin

This process provides goldplated contact pins, used in circuit board assemblies and the like, with a solder stop. The gold plating on edge A of the contact pin is removed by machine grinding. The pins are then heated in an oven to approximately 400 degrees C for fifteen minutes to provide a nickel oxide barrier which is nonwetting to molten solder. After the pins are thus treated, they are ready for use in board assembly work. The pins are inserted through the appropriate solder rings and flux. The pins are properly located by pushing them through holes in the board until stopped by the heads of the pins. When the soldering heat is applied to the assembled board by placing it in an oven, solder flow to head B of the pin is prevented by the nickel oxide barrier and the nonwetting characteristics.

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