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Lamination Process

IP.com Disclosure Number: IPCOM000093150D
Original Publication Date: 1967-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 31K

Publishing Venue

IBM

Related People

Ellis, TL: AUTHOR

Abstract

Unetched circuit board laminates composed of an epoxy-impregnated substrate and copper foil can be made in a semicontinuous process.

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Lamination Process

Unetched circuit board laminates composed of an epoxy-impregnated substrate and copper foil can be made in a semicontinuous process.

In drawing A, glass fiber cloth, impregnated with a partially cured epoxy resin, moves from supply reels 1....4 concurrently with top and bottom strips of copper from supply reels 5 and 6 through pressure rolls 7. The latter align and compress the strip prior to passage through a pair of edge folders 8. The copper strips are each wider than the cloth and are folded over at 8 and closed by sealing rollers 9. The epoxy-impregnated cloth is thus contained in a flat envelope of copper and passes through mold 10 in hydraulic press 11.

Mold 10 is shown in drawing B. The bottom mold half 13 is provided with recesses 14 to accommodate the folded edges of copper and serve as an overflow for excess epoxy. The stack of copper and cloth strips is positioned in the center recess 15 of mold 10 and compressed by the top mold half 16. Since the epoxy requires additional curing, both heat and pressure are applied for the necessary period of time. Press 11 is then opened and feed rolls 17 draw a new section of uncured laminate into mold 10. Press 11 is automatically cycled by control mechanism 18 which also operates rolls 7 and 17. Upon leaving rolls 17, the finished laminate can be cut to desired lengths and the folded copper margins trimmed.

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