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Browse Prior Art Database

Deposited Noise Reducing Ground Plane

IP.com Disclosure Number: IPCOM000093189D
Original Publication Date: 1967-Jun-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Thun, RE: AUTHOR

Abstract

As integrated circuit arrays become larger and more complex, the track length of parallel metallic conductors, e. g., conductors 1 and 1' formed on thin insulating layer 3 above host semiconductor wafer 5, has increased along with a corresponding increase in cross-talk noise. Generally, to provide environmental protection, thick protective layer 7, either of organic or inorganic material, is formed over an integrated circuit array as a final layer. To prevent cross-talk noise and provide added environmental protection, decoupling shield 9, e. g., of gold, platinum, etc., is deposited over layer 7 as a continuous sheet. Such depositing occurs except over and around via holes 11 which allow access to contact pads 13 on wafer 5. Decoupling shield 9 is connected to a reference potential, e. g., ground.

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Deposited Noise Reducing Ground Plane

As integrated circuit arrays become larger and more complex, the track length of parallel metallic conductors, e. g., conductors 1 and 1' formed on thin insulating layer 3 above host semiconductor wafer 5, has increased along with a corresponding increase in cross-talk noise. Generally, to provide environmental protection, thick protective layer 7, either of organic or inorganic material, is formed over an integrated circuit array as a final layer. To prevent cross-talk noise and provide added environmental protection, decoupling shield 9, e. g., of gold, platinum, etc., is deposited over layer 7 as a continuous sheet. Such depositing occurs except over and around via holes 11 which allow access to contact pads 13 on wafer 5. Decoupling shield 9 is connected to a reference potential, e. g., ground.

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