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Cutting a Monocrystalline Semiconductor

IP.com Disclosure Number: IPCOM000093240D
Original Publication Date: 1967-Jul-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 35K

Publishing Venue

IBM

Related People

Fischer, GR: AUTHOR [+2]

Abstract

Semiconductor monocrystal 1, which is to be cut into a plurality of wafers, is first mounted on crescent-shaped, wooden block support 2. A tube of shrinkable thermoplastic 3 is then placed over monocrystal 1 supported with block 2. The assembly is then heated to shrink tubing 3 around the supported monocrystal 1 to produce a close fitting arrangement. Monocrystal 1 is now ready for conventional cutting into wafers. After the cutting operation tubing 3 is readily removed from the wafers.

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Cutting a Monocrystalline Semiconductor

Semiconductor monocrystal 1, which is to be cut into a plurality of wafers, is first mounted on crescent-shaped, wooden block support 2. A tube of shrinkable thermoplastic 3 is then placed over monocrystal 1 supported with block 2. The assembly is then heated to shrink tubing 3 around the supported monocrystal 1 to produce a close fitting arrangement. Monocrystal 1 is now ready for conventional cutting into wafers. After the cutting operation tubing 3 is readily removed from the wafers.

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