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Cutting Fine Lead Wires After Ultrasonic Bonding

IP.com Disclosure Number: IPCOM000093257D
Original Publication Date: 1967-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Miller, BW: AUTHOR

Abstract

This ultrasonic bonding head carries a device for severing the wire after a bond has been made. Ultrasonic transducer 1, which can be of the magnetostrictive type, induces longitudinal vibrations in ultrasonic concentrator 2. Bonding tip 3, fixed to the end of concentrator 2, has a bonding portion shown in enlarged form. Wire 4 to be bonded is fed through hole 5 at the rear of tip 3. Slot 6 in the lower portion of tip 3 engages wire 4 and presses it against a material to which the bond is made. At the conclusion of the bonding operation, knife 7 is energized by actuator 8 to sever wire 4 in between the region of the bond and hole 5. Prior to the next bonding operation, wire 4 is fed through hole 5 a sufficient distance to place a portion of the wire underneath slot 6.

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Cutting Fine Lead Wires After Ultrasonic Bonding

This ultrasonic bonding head carries a device for severing the wire after a bond has been made. Ultrasonic transducer 1, which can be of the magnetostrictive type, induces longitudinal vibrations in ultrasonic concentrator 2. Bonding tip 3, fixed to the end of concentrator 2, has a bonding portion shown in enlarged form. Wire 4 to be bonded is fed through hole 5 at the rear of tip 3.

Slot 6 in the lower portion of tip 3 engages wire 4 and presses it against a material to which the bond is made. At the conclusion of the bonding operation, knife 7 is energized by actuator 8 to sever wire 4 in between the region of the bond and hole 5. Prior to the next bonding operation, wire 4 is fed through hole 5 a sufficient distance to place a portion of the wire underneath slot 6. As tip 3 is again positioned against the material to which the bond is made, wire 4 slides into groove 6 preparatory to making the bond.

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