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Electrodeposition of Copper from Solutions of the Salt Copper Sulfate Hexahydrate CuSo(4) (NH(4))(2)SO(4)6H(2)O

IP.com Disclosure Number: IPCOM000093265D
Original Publication Date: 1967-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Krawczyk, RJ: AUTHOR

Abstract

Copper is deposited from an electrodeposition bath comprising the following: Cu/++/ ------------ 23 to 61 grams per liter NH(4)/+/ (as ›NH(4)|(2)SO(4)) 13 grams/liter to saturation pH ------------ 6.0 to 9.5 A preferred bath is constituted as follows: Cu/++/ ------------- 46 grams/liter NH/+/ (as(NH(4))(2)SO(4)| 9.5 grams/liter to saturation pH ------------- 8.5 pH adjustment made with NH(4)OH or NH.

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Electrodeposition of Copper from Solutions of the Salt Copper Sulfate Hexahydrate CuSo(4) (NH(4))(2)SO(4)6H(2)O

Copper is deposited from an electrodeposition bath comprising the following: Cu/++/ ------------ 23 to 61 grams per liter NH(4)/+/ (as >NH(4)|(2)SO(4)) 13
grams/liter to saturation pH ------------ 6.0 to 9.5 A preferred bath is constituted as
follows: Cu/++/ ------------- 46 grams/liter NH/+/ (as(NH(4))(2)SO(4)| 9.5
grams/liter to saturation pH ------------- 8.5 pH adjustment made with NH(4)OH or
NH.

Additionally, antipit agents such as aliphatic sulfonates can be added, as well as brightener additives, e.g., d2-mercaptobenzothiazol and p-toluene sulfonic acid. Insoluble anodes are used. Copper content is maintained by salt additions.

The electrochemical efficiency of the two baths varies with the cathode current density. Satisfactory deposits are obtained with between 30 and 90 amperes per square foot. The optimum cathode current density is 75 amperes per square foot, which gives an average electrochemical efficiency of 70%. Copper plated from the above is found to be fine grained, columnar in structure, extremely dense, very hard and very pure.

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