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Solder Reflow Device

IP.com Disclosure Number: IPCOM000093266D
Original Publication Date: 1967-Aug-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Carpenter, RW: AUTHOR [+3]

Abstract

In a flow solder machine, preassembled panels containing various electric and electronic components pass over a solder wave. The latter leaves a deposit of solder on the component leads and circuitry of each card in the panel. It is desirable that solder touch-up operations on the panels follow immediately after the automated operations. This device permits such touch-up operations.

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Solder Reflow Device

In a flow solder machine, preassembled panels containing various electric and electronic components pass over a solder wave. The latter leaves a deposit of solder on the component leads and circuitry of each card in the panel. It is desirable that solder touch-up operations on the panels follow immediately after the automated operations. This device permits such touch-up operations.

Floating washers 10 are arranged side-by-side across the panel path. In such a reflow device, it is necessary to overcome the surface tension holding the solder to the panel and to remove and carry away the excess solder. The washer reflow device is arranged so that each washer 10 has an independent vertical action.

This action allows some washers to make contact with the panel while adjacent washers 10 are being depressed by the protruding component leads. Washers 10 must rotate freely to carry away the excess solder. Solder fountain 11, with baffles 12 and 13 installed, functions to contain the washers, to permit floating action, to prevent drifting, and to allow a free rotation.

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