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Etch for Removing Gold

IP.com Disclosure Number: IPCOM000093356D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Flitsch, R: AUTHOR

Abstract

Most etches that attack gold also strongly attack an underlying substrate, as in the case of a gold film deposited on Co-Fe-Ni and Fe-Ni thin films. An etch particularly effective for removing gold without, however, attacking the underlying substrate includes a KI solution to which a few crystals of iodine are added. The concentration of the solution, typically 10%, can be varied over a wide range and still be effective. To this solution small quantities of 30% H(2)O(2) are added. The effect of such addition is to enhance the rate of reaction until complete dissolution of the gold, but not the substrate, is achieved.

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Etch for Removing Gold

Most etches that attack gold also strongly attack an underlying substrate, as in the case of a gold film deposited on Co-Fe-Ni and Fe-Ni thin films. An etch particularly effective for removing gold without, however, attacking the underlying substrate includes a KI solution to which a few crystals of iodine are added. The concentration of the solution, typically 10%, can be varied over a wide range and still be effective. To this solution small quantities of 30% H(2)O(2) are added. The effect of such addition is to enhance the rate of reaction until complete dissolution of the gold, but not the substrate, is achieved.

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