Browse Prior Art Database

Prevention of Cracking in Copperplated Polymeric Insulators

IP.com Disclosure Number: IPCOM000093358D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bolin, HR: AUTHOR [+3]

Abstract

The cracking of copperplated organic polymer insulators is prevented by first depositing a layer of copper on the insulator by an electroless process. Then copper is electrodeposited over the electroless layer within a short time, i.e., within about 5 minutes or less. This process results in a copperplated insulator which does not need heat curing to give a satisfactory bond between copper and insulator and which can withstand high temperatures without cracking.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 66% of the total text.

Page 1 of 1

Prevention of Cracking in Copperplated Polymeric Insulators

The cracking of copperplated organic polymer insulators is prevented by first depositing a layer of copper on the insulator by an electroless process. Then copper is electrodeposited over the electroless layer within a short time, i.e., within about 5 minutes or less. This process results in a copperplated insulator which does not need heat curing to give a satisfactory bond between copper and insulator and which can withstand high temperatures without cracking.

Ordinarily, it is necessary to heat cure copperplated organic insulators in order to improve adhesion between the electroless copper and the insulator. When insulators plated with only electroless copper are heated for this purpose, the insulator often cracks due to the different coefficients of expansion of the insulator and the copper.

The combination of electroless and electrodeposited plating not only eliminates the necessity for a heat cure step, but minimizes cracking of the insulator when it is heated in subsequent processing operations. The process is thus particularly useful in magnetic thin-film technology. The process prevents the cracking of copperplated photoresist insulating materials, such as copperplated polyvinyl cinnamates, polyisoprenes or styrene-butadiene polymers, when they are used to make integrated memory devices.

A layer of copper 500 Angstroms thick is deposited from a Shipley 328 A & B electroless bath on a polyisopren...