Browse Prior Art Database

Batch Fabricated Tape Heads

IP.com Disclosure Number: IPCOM000093363D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 45K

Publishing Venue

IBM

Related People

Grebe, KR: AUTHOR

Abstract

The multitrack tape head is formed on the track surface 10 of a substrate 12, drawing A. This surface is first covered with a layer 11, of SiO(2), drawing B, after which the first half of head winding 14A is formed using an appropriate printed circuit type technique. A further coating 16 of SiO(2) is then deposited and followed by a first thin magnetic film layer 18A of permalloy. Layer 20 of SiO(2) is then deposited, drawing C, to cover all but the top portion of layer 18A. The other half 14B of the head winding is then laid down. Another layer 22, drawing D, of SiO(2) is then deposited. Then the magnetic portion of the head is completed by depositing a second layer 18B of permalloy.

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Batch Fabricated Tape Heads

The multitrack tape head is formed on the track surface 10 of a substrate 12, drawing A. This surface is first covered with a layer 11, of SiO(2), drawing B, after which the first half of head winding 14A is formed using an appropriate printed circuit type technique. A further coating 16 of SiO(2) is then deposited and followed by a first thin magnetic film layer 18A of permalloy. Layer 20 of SiO(2) is then deposited, drawing C, to cover all but the top portion of layer 18A. The other half 14B of the head winding is then laid down. Another layer 22, drawing D, of SiO(2) is then deposited.

Then the magnetic portion of the head is completed by depositing a second layer 18B of permalloy. The latter contacts the first layer 18A at the top of the device but is separated from the first layer at the bottom of the device by the intervening layers of SiO(2) to form a narrow gap. The entire surface can then be covered by a protective layer of SiO(2).

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