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Wiping Pressure Contact for Unilayer Circuit Boards

IP.com Disclosure Number: IPCOM000093367D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Hinkley, KS: AUTHOR [+4]

Abstract

This arrangement permits connections to be made between planes of circuits. A prepunched dielectric laminated with a spring-tempered conductive material is utilized. Base 1 is provided with a plurality of bell shaped contacts 2 which extend slightly above the base. Beryllium copper 3, laminated to dielectric 4, is etched to provide particular circuit configurations. Beryllium copper 3 is also provided with extensions 5 bent at an angle so as to make a wiping contact with the adjacent circuit layers 5. A resilient sheet or air bag 6 contacts the top circuit layer and is held in position by frame 7 secured to base 1.

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Wiping Pressure Contact for Unilayer Circuit Boards

This arrangement permits connections to be made between planes of circuits. A prepunched dielectric laminated with a spring-tempered conductive material is utilized. Base 1 is provided with a plurality of bell shaped contacts 2 which extend slightly above the base. Beryllium copper 3, laminated to dielectric 4, is etched to provide particular circuit configurations. Beryllium copper 3 is also provided with extensions 5 bent at an angle so as to make a wiping contact with the adjacent circuit layers 5. A resilient sheet or air bag 6 contacts the top circuit layer and is held in position by frame 7 secured to base 1.

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