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Word Line Impedance Minimization in Continuous Film Memory by Dispersion Control

IP.com Disclosure Number: IPCOM000093406D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Bertelsen, BI: AUTHOR

Abstract

The impedance of word lines in continuous film memories is minimized by reducing or eliminating the magnetic loading in the unused film under the word lines. This is done by imparting a sufficiently high dispersion to the film so that remanence of the magnetic field imparted by a word pulse is maintained at the skew angle employed, i.e., the angle between word field direction and film hard axis.

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Word Line Impedance Minimization in Continuous Film Memory by Dispersion Control

The impedance of word lines in continuous film memories is minimized by reducing or eliminating the magnetic loading in the unused film under the word lines. This is done by imparting a sufficiently high dispersion to the film so that remanence of the magnetic field imparted by a word pulse is maintained at the skew angle employed, i.e., the angle between word field direction and film hard axis.

If a bidirectional storage mode is used, the dispersion level should not be increased beyond that necessary to give hard direction locking at the maximum skew angle employed. Increasing the dispersion beyond this level increases the additional bit field required to overcome the increased dispersion. The technique of locking magnetization between storage regions is also useful in coupled film structures which suffer from high magnetic loading of word lines, i.e., those having a continuous strip of magnetic material around the word line.

Methods for achieving proper control of film dispersion include increasing the substrate temperature during film deposition of NiFe or NiFeCo permalloys in the vacuum deposition or sputtering processes in order to increase dispersion, adding copper or manganese to NiFe in the cathodic sputtering process while maintaining relatively low substrate temperature, or the like. Methods for controlling film dispersion are described by E. W. Pugh and T. O. Mohr in Thin ...