Browse Prior Art Database

Land Support

IP.com Disclosure Number: IPCOM000093419D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 27K

Publishing Venue

IBM

Related People

Steranko, JJ: AUTHOR

Abstract

The use of ultrasonic bonding techniques to fasten small wires to lands on a multilayer substrate tends to shear the lands from the substrate. Additional support for lands 1 is provided by applying epoxy fill 3 to board 2 by a doctor blade. The resulting structure has a smooth surface which provides additional support to lands 1 and also tends to reduce the accumulation of contaminants.

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Land Support

The use of ultrasonic bonding techniques to fasten small wires to lands on a multilayer substrate tends to shear the lands from the substrate. Additional support for lands 1 is provided by applying epoxy fill 3 to board 2 by a doctor blade. The resulting structure has a smooth surface which provides additional support to lands 1 and also tends to reduce the accumulation of contaminants.

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