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Reducing Electrical Contact Resistance of Reflowed Solder Mound Terminals

IP.com Disclosure Number: IPCOM000093436D
Original Publication Date: 1967-Sep-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Herdzik, RJ: AUTHOR [+2]

Abstract

This technique facilitates the testing of semiconductor devices by reducing the electrical contact resistance of reflowed solder terminals.

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This is the abbreviated version, containing approximately 100% of the total text.

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Reducing Electrical Contact Resistance of Reflowed Solder Mound Terminals

This technique facilitates the testing of semiconductor devices by reducing the electrical contact resistance of reflowed solder terminals.

Solder-mound terminals form a layer of PbO on the surface which is quite tenacious and has a relatively high electrical resistance. In testing devices, this layer should desirably be removed to insure good electrical contact with the testing circuit. In view of the physical properties of the PbO coating, this procedure is difficult and the results are not always uniform.

This technique involves the application of a thin coating of Sn or Ag to the solder-mound terminals prior to testing. The Sn or Ag can be applied by a conventional electroless plating bath. The Sn coating forms a protective coating over the solder on the surface of the terminal. An Ag coating also forms a protective low resistance coating on the terminal. These coatings prevent the formation of PbO and thus reduce the electrical resistance of the contact.

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