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Release Lubricant

IP.com Disclosure Number: IPCOM000093463D
Original Publication Date: 1967-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Holowatch, PJ: AUTHOR [+2]

Abstract

This lubricant release agent is particularly adapted for removing an integrated circuit module and the like from an encapsulation mould.

This text was extracted from a PDF file.
This is the abbreviated version, containing approximately 100% of the total text.

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Release Lubricant

This lubricant release agent is particularly adapted for removing an integrated circuit module and the like from an encapsulation mould.

The ingredients of the release lubricant are a dye FLUOROL*, a solvent SOLOX**, and a commercially available liquid soap. The contents of the soap as determined by infrared and emission spectrometry are: 1. Coconut oil base having a high sodium content 2. Glycerol, liquid 3. Glycerol ester, liquid 4. Water.

Contents 1...3 comprise 25% by volume of the total and the water the remainder. The sodium content is 2% by weight of the total.

The mixture of the ingredients of the release lubricant can be compounded as follows: Dye - 0.5 grams

Soap - 500 grams

Solvent - 3000 grams.

The release agent does not adhere to the RTV encapsulant when the encapsulant module is removed from the mould. Furthermore, the release lubricant is easily cleaned off or removed from the mould as well as the encapsulation on the module by appropriate solvents. *Trademark of General Aniline & Film Corp. **Trademark of U. S. Industrial Chemicals Co.

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