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Metallization of KTFR

IP.com Disclosure Number: IPCOM000093464D
Original Publication Date: 1967-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Hall, DW: AUTHOR [+2]

Abstract

A process is provided for metallizing a polyimide film or a photoresist such as KTFR. The process entails the sequential steps of: 1. Dipping film in chromic sulfuric acid, 30gk(2)Cr(2)O7.2H(2)O in 50 ml H(2)O diluted to 1 liter with conc. H(2)SO(4), 2. Rinsing in H(2)O, 3. Dipping film in SnCl(2)2H(2)O, 30g/liter, 4. Dipping film in PdCl(2), 0.1%, 5. Rinsing in H(2)O 6. Repeating steps 3,4, and 5, 7. Plating film in Shipley 328 for 10 minutes, 8. Drying in vacuum for 10 minutes at 100 degrees C. 9. Repeating steps 7 and 8, and 10. Electroplating film with desired metal.

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Metallization of KTFR

A process is provided for metallizing a polyimide film or a photoresist such as KTFR. The process entails the sequential steps of: 1. Dipping film in chromic sulfuric acid, 30gk(2)Cr(2)O7.2H(2)O in 50 ml H(2)O diluted to 1 liter with conc. H(2)SO(4), 2. Rinsing in H(2)O, 3. Dipping film in SnCl(2)2H(2)O, 30g/liter, 4. Dipping film in PdCl(2), 0.1%, 5. Rinsing in H(2)O 6. Repeating steps 3,4, and 5, 7. Plating film in Shipley 328 for 10 minutes, 8. Drying in vacuum for 10 minutes at 100 degrees C. 9. Repeating steps 7 and 8, and
10. Electroplating film with desired metal.

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