Browse Prior Art Database

Soldering of Components onto SLT Cards

IP.com Disclosure Number: IPCOM000093472D
Original Publication Date: 1967-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 38K

Publishing Venue

IBM

Related People

Alapetite, P: AUTHOR [+2]

Abstract

Assembly of components onto printed circuit cards or boards is carried out in two steps. First, the components are positioned onto the card. Secondly, the components are flow-soldered onto the card.

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Soldering of Components onto SLT Cards

Assembly of components onto printed circuit cards or boards is carried out in two steps. First, the components are positioned onto the card. Secondly, the components are flow-soldered onto the card.

When a card and its components are placed in the solder flow, the spring contacts are protected by a special plate made either of nonsolder-wetted material, aluminum, or of solder-wetted material, copper. In the first case, the first line of card holes is not reached by the solder, drawing 1. In the second case, the solder comes into contact with the spring contacts, drawing 2.

It is possible to eliminate both types of defects by protecting the spring contacts by a special plate made of nonsolder-wetted material. On the plate and facing the first line of card holes are fixed rivets R which are made of solder- wetted material. These rivets facilitate solder flowing into the card holes closest to the protection plate, drawing 3.

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