Browse Prior Art Database

Low Temperature Device for Electrical Interconnection to an Integrated Laser Array

IP.com Disclosure Number: IPCOM000093498D
Original Publication Date: 1967-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 53K

Publishing Venue

IBM

Related People

Smith, JF: AUTHOR

Abstract

This integrated laser array is suitable for operation at very low temperatures.

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Low Temperature Device for Electrical Interconnection to an Integrated Laser Array

This integrated laser array is suitable for operation at very low temperatures.

Copper slab 1 serves both as a heat sink and an electrical ground plane. Nestled within a central opening in slab 1 is sapphire disk 2. A plurality of conductors 3 provides electrical contact for array 4 of semiconductor lasers. The electrical contacts actuate ten adjacent lasers approximately 0.002" wide on
.01010" centers, but larger arrays can be accommodated if desired. Each electrical contact is fanned out into widened areas 3', so that such contacts act as heat sinks additionally to slab 1.

To each connector is soldered a contact 5 so that suitable RF energy can be applied to the laser array. Metal clamp 6 is attached by bolts 7 to slab 1. A portion 8 of clamp 6 is urged against array 4 and contacts 3 by pressure adjusting screw 9. The electrical path for laser actuation is through contact 5, connector 3'-3, array 4, clamp 6, slab 1 and back to the RF source not shown. The entire assembly is lowered into a refrigerator and disk 2 lies on the cold finger of such refrigerator.

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