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Mechanical Polisher for Wafers

IP.com Disclosure Number: IPCOM000093519D
Original Publication Date: 1967-Oct-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Evanoski, W: AUTHOR [+4]

Abstract

This polisher has a variable speed drive and variable polishing pressure. A wide variety of materials can be polished.

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Mechanical Polisher for Wafers

This polisher has a variable speed drive and variable polishing pressure. A wide variety of materials can be polished.

Variable speed and reversible motor 20 drives gear 22 including portion 24. Gear 22 engages gear 26 which is part of pressure plate assembly 28. Flange member 30 and piston head 32 are joined to gear 26 to form the single unit pressure plate assembly. Bearing 34 is included in head 32 to receive piston rod
36. Mounting plate 38 is suitably connected to head 32 by screws or pins not shown. Plate 38 is adapted to hold approximately twenty wafers which are 1-1/4" in diameter. The wafers are waxed to plate 38 for attachment to it. Polishing plate 40 is located beneath plate 38.

Variable pressure and variable rotation can be applied to the wafers through the pressure plate assembly. The wafers can be rotated in one direction or the other according to the motor rotation direction. Flange 30 relieves the pressure on gear 22 as the wafers are polished.

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