Browse Prior Art Database

Coating Method

IP.com Disclosure Number: IPCOM000093550D
Original Publication Date: 1967-Nov-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 56K

Publishing Venue

IBM

Related People

Bryden, JR: AUTHOR

Abstract

A thin protective layer can provide a conducting path between conductors 1 during electroplating to give mote uniform current density and prevent attack by the plating solution on the bond between conductors 1 and the substrate 3, drawing A.

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Coating Method

A thin protective layer can provide a conducting path between conductors 1 during electroplating to give mote uniform current density and prevent attack by the plating solution on the bond between conductors 1 and the substrate 3, drawing A.

The first step in the process is to deposit thin conducting layer 4, preferably copper, over the upper surface of substrate 3 with conductors 1 on it as in drawing B. Next, in drawing C, resist layer 5 is deposited between conductors 1 by known methods.

Then substrate 3 is placed in a plating bath and contact made to the commoning bars and plated with nickel forming layer 6 in drawing D. Finally, resist layer 5, unwanted areas of layer 4, and the commoning bars are removed by chemical methods leaving conductors 1 with plating 6 as in drawing E.

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