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A Variable Speed Polishing Machine

IP.com Disclosure Number: IPCOM000093583D
Original Publication Date: 1967-Nov-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Druzba, PR: AUTHOR

Abstract

This apparatus has a variable speed, reversible polishing wheel and accessory drive shaft. Independent slurry and cooling water circulation systems provide improved polishing of wafers, typically semiconductors.

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A Variable Speed Polishing Machine

This apparatus has a variable speed, reversible polishing wheel and accessory drive shaft. Independent slurry and cooling water circulation systems provide improved polishing of wafers, typically semiconductors.

A polishing wheel is attached to a turntable driven by a variable speed and reversible motor. The polishing wheel includes radial apertures and vertical holes to permit a cooling medium, typically water, to flow from a special manifold surrounding the accessory shaft to the radial channels. The cooling water leaves the channels through the vertical holes to a drain concentrically aligned with the polishing wheel. A polishing slurry flows in an independent manifold, concentrically aligned with the accessory shaft and the cooling water manifold, to the upper surface of the polishing wheel. Both the slurry and water are urged to the periphery of the polishing wheel by centrifugal force as the polishing wheel rotates. The slurry and water are collected in independent drains concentrically aligned with the polishing wheel, and can be either discharged or recirculated.

The turntable for the polishing machine is mounted on a ball bearing ring and includes an internal gear which is engaged by a drive gear suitably driven through a shaft, coupling and gear unit. The turntable is suitably aligned with the polishing wheel by location pins. A wafer to be polished is disposed on the upper surface of the polishing wheel and held in po...