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Solder Tip

IP.com Disclosure Number: IPCOM000093649D
Original Publication Date: 1967-Nov-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 49K

Publishing Venue

IBM

Related People

Carl, H: AUTHOR

Abstract

Resistance-heated soldering tips can be made by etching and folding electrical resistance material sheet stock. By configuring the tip to have a truncated pyramidal shape, a self-supporting structure having a number of circularly arranged solder points is realized.

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Solder Tip

Resistance-heated soldering tips can be made by etching and folding electrical resistance material sheet stock. By configuring the tip to have a truncated pyramidal shape, a self-supporting structure having a number of circularly arranged solder points is realized.

A five-one thousandths inch thick sheet 10 of tantalum or molybdenum is etched according to the layout shown in the bottom drawing and the resulting cross-shaped part is cut from the sheet. Wings 12 are then folded into the pyramidal shape as in the top left drawing. Central aperture 14 intercepts the apex portion of the pyramid, making it a folded into the pyramidal shape as in the top left drawing. Central frustum and defining, together with corner slots 16 of the pyramid, a circular array of neck portions 18, 20, 22, and 24 which become the solder points. Mounting holes 26, 28, 30, and 32 in the wings provide for securing the tip in an operating holder and for making the electrical connections.

The right top drawing shows the current paths through the neck portions when the tip is energized with the polarities shown. Being of restricted width, the neck portions are heated by the current to a soldering temperature. Since the potential pattern is balanced, no current flows from solder point to solder point through the work. Any number of solder points can be provided by dividing the figure into a like number of wings. For even heating and potential balance, an even number of wings energized...