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Pretreatment of Magnetic Thin Film Beryllium Copper Substrates

IP.com Disclosure Number: IPCOM000093740D
Original Publication Date: 1966-Feb-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Romankiw, LT: AUTHOR [+3]

Abstract

A process is provided for preparing a beryllium-copper substrate for the reception of an electrolessly plated or an electrodeposited magnetic thin film. That process entails the sequential steps of: 1. Cleaning the beryllium-copper substrate in acetone, 2. Immersing the substrate for 30 seconds in an orthophosphoric acid, hydrogen sulfide and water solution consisting essentially of by weight percent H(3)PO(4), 73%; H(2)S 0.15%, bubbled through the solution while the substrate is being immersed; H(2)O, balance 3. Rinsing the member in deionized water, 4. Immersing the substrate for 30 seconds in a hydrochloric acid solution containing 1 part H(2)O to 4 parts HCl, 5. Rinsing the substrate in deionized water, 6.

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Pretreatment of Magnetic Thin Film Beryllium Copper Substrates

A process is provided for preparing a beryllium-copper substrate for the reception of an electrolessly plated or an electrodeposited magnetic thin film. That process entails the sequential steps of: 1. Cleaning the beryllium-copper substrate in acetone, 2. Immersing the substrate for 30 seconds in an orthophosphoric acid, hydrogen sulfide and water solution consisting essentially of by weight percent H(3)PO(4), 73%; H(2)S 0.15%, bubbled through the solution while the substrate is being immersed; H(2)O, balance 3. Rinsing the member in deionized water, 4. Immersing the substrate for 30 seconds in a hydrochloric acid solution containing 1 part H(2)O to 4 parts HCl, 5. Rinsing the substrate in deionized water, 6. Immersing the element for 30 seconds in a nitric acid, sulfuric acid and water solution consisting of by weight percent, HNO(3), 16%; H(2)SO(4), 20%; H(2)O, balance, 7. Rinsing the substrate in deionized water, 8. Preimmersing the substrate for 30 seconds in the solution of step 2 above 9. Rinsing the solution in deionized water, 10. Immersing for 30 seconds the substrate in the hydrochloric acid water solution of step 4 to which has been added 3 milliliters of 1 1 1 gram per liter of sodium hypophosphite (NaH(2)PO(2) . H(2)O) per 500 milliliters of solution, 11. Thereafter immersing the substrate in a palladium chloride water solution for 5 seconds consisting essentially of 0.1 weight percent P...