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Process for Removal of Silicone Resins

IP.com Disclosure Number: IPCOM000093746D
Original Publication Date: 1966-Feb-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 12K

Publishing Venue

IBM

Related People

Hamilton, NF: AUTHOR [+2]

Abstract

This cleaning process utilizes a primary amine in combination with water. The process is useful for removing encapsulating silicone resins from modules or other encapsulated electrical components where the corrosion of the elements must be avoided.

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Process for Removal of Silicone Resins

This cleaning process utilizes a primary amine in combination with water. The process is useful for removing encapsulating silicone resins from modules or other encapsulated electrical components where the corrosion of the elements must be avoided.

Silicone resins, in particular RTV* and dielectric gels, are used for encapsulating electrical components. The cured silicone resins used to encapsulate are usually relatively soft rubber-like materials. On occasion when the module must be visually inspected it is necessary to remove the encapsulating resin without altering or corroding the underlying circuitry and components. Conventional removal agents are acidic in nature and quite corrosive. A preferred technique of this method is to expose the encapsulated component to the vapors of boiling n-butylamine, b.p. 77.8 degrees C while periodically spraying it with distilled solvent. The length of the exposure depends on the thickness of the encapsulating component. A final rinse in either alcohol or water or both removes any trace of the n-butylamine.

The silicone coating can also be conveniently removed by immersion and solvent agitation in an aqueous n-butylamine-water solution. This is preferably maintained at a temperature above room temperature.

In general, primary aliphatic amines can be employed to remove silicone resins. When a primary amine and water are combined the resultant solution is basic which operates to depolymer...