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Electrically Conductive Adhesive

IP.com Disclosure Number: IPCOM000093757D
Original Publication Date: 1966-Feb-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 1 page(s) / 11K

Publishing Venue

IBM

Related People

Melan, EH: AUTHOR [+2]

Abstract

A strong and relatively impervious adhesive which is electrically conductive and stable is formed by dispersing powdered conductive particles throughout a polymer coating material of the aromatic polyimide variety. The adhesive is used both as a planar semiconductor device or chip contact and as an electrode. The adhesive includes 30-70%, by weight, of conductive particles such as gold dispersed throughout a coating material such as PYRE-ML*.

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Electrically Conductive Adhesive

A strong and relatively impervious adhesive which is electrically conductive and stable is formed by dispersing powdered conductive particles throughout a polymer coating material of the aromatic polyimide variety. The adhesive is used both as a planar semiconductor device or chip contact and as an electrode. The adhesive includes 30-70%, by weight, of conductive particles such as gold dispersed throughout a coating material such as PYRE-ML*.

As a chip contact, the adhesive is applied in paste form between terminal areas of the chip device and connecting areas on a dielectric supporting substrate. Firing is effected at relatively low temperatures, typically 100-300 degrees C, to form a relatively high-strength bond both with the substrate and chip device.

As an electrode, the paste is applied to a dielectric supporting substrate using silk screening techniques and fired at the same low temperatures to form a conductive land pattern. Conductivity is proportional both to percentage of conductive particles and thickness of the pattern. * Trademark of E. I. du Pont de Nemours and Company.

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