Browse Prior Art Database

Packaging for Monolithic Circuits

IP.com Disclosure Number: IPCOM000093818D
Original Publication Date: 1966-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Wilcox, DL: AUTHOR [+2]

Abstract

This package provides hermetic sealing for monolithic circuits and cooling by liquid in close proximity to the circuit.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Packaging for Monolithic Circuits

This package provides hermetic sealing for monolithic circuits and cooling by liquid in close proximity to the circuit.

Multilayered ceramic member 20 includes buried conductors 22 and recess 24 which accommodates monolithic circuit 26. Terminals 28 of circuit 26 engage the conductors 22 for connection to outside circuits. Thin metal foil 30 is gap- welded to the flange member 32 or a low-temperature brazing of gold germanium type material is employed to effect the hermetic seal between foil 30 and member
32. The application of pressure via fluid to foil 30 improves heat transfer. Alternatively, foil 32 can be bonded to the back side of circuit 26.

One example of a good foil material is KOVAR* or KOVAR clad copper for higher thermal conductivity. Other metals can be employed, provided the metal is processed to remove natural resiliency. Metals processed to remove resiliency have improved contact to monolithics.

1

Page 2 of 2

2

[This page contains 1 picture or other non-text object]