Browse Prior Art Database

Printed Circuit Package

IP.com Disclosure Number: IPCOM000093835D
Original Publication Date: 1966-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 87K

Publishing Venue

IBM

Related People

Johnson, AH: AUTHOR [+4]

Abstract

This printed circuit package combines the capability of SMS, Standard Modular System, to carry large discrete components and the capability of SLT, Solid Logic Technology, to carry hybrid integrated modules or integrated flat pack modules efficiently and economically.

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Printed Circuit Package

This printed circuit package combines the capability of SMS, Standard Modular System, to carry large discrete components and the capability of SLT, Solid Logic Technology, to carry hybrid integrated modules or integrated flat pack modules efficiently and economically.

The regular single-sided SMS card 10, see U. S. Patent 3,008,113, is used having sixteen of the edge contact tabs 11. This printed package card 12 is an SLT type card having outer signal layers and an internal plane and a matrix of plated through-holes 13.

Card 12 is the same size as the SMS card 10 except that the bottom is slightly wider to accommodate 20 of the edge contact tabs 14 on each side. Twin-size cards 10 and 12 can also be employed composed of two cards of the same kind joined side by side.

Socket 15 has two rows of opposing spring contacts 16 between which cards 10 and 12 are plugged. The projecting ends 17 of contacts 16 are interconnected by printed wiring overlay circuit 18. Overlay circuit 18 is multilayered and is slid over contact ends 17 and soldered in place by solder rings. Overflow wiring can be achieved by wire wrapping between contact ends
17.

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