Browse Prior Art Database

Semiconductor Furnace Heat Control

IP.com Disclosure Number: IPCOM000093896D
Original Publication Date: 1966-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 32K

Publishing Venue

IBM

Related People

Piper, H: AUTHOR

Abstract

This temperature sensing arrangement is for a semiconductor furnace in which a thermocouple placed near the furnace load provides more accurate heat control.

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Semiconductor Furnace Heat Control

This temperature sensing arrangement is for a semiconductor furnace in which a thermocouple placed near the furnace load provides more accurate heat control.

Furnace 10 i s provided with a number of heating coils 12 and muffle 14 within which the device 16 being heated is located. Thermocouple 18 is positioned near coils 12 and provides a controlling input to heat control unit 20. Vernier thermocouple 22 is positioned as close as possible to device 16 and provide s an additional controlling input to control 20.

When device 16 is initially inserted into furnace 10, it causes a temperature drop in its immediate area. This effect is sensed by thermocouple 22 which in response, cause s control 20 to energize coils 12. This effectively reduce s the time lag which would normally occur if only thermocouple 18 were utilized. As coils 12 bring furnace 10 back up to the desired temperature thermocouple 18 is the first to sense when the desired temperature is reached and thus provides the shut off signal to control 20. In this manner, there is little temperature overshoot within furnace 10.

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