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Microcircuit Heat Sink

IP.com Disclosure Number: IPCOM000093898D
Original Publication Date: 1966-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Cherniack, GB: AUTHOR [+3]

Abstract

This heat sink provides a relatively large surface area for cooling and can be employed with a wide variety of material.

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Microcircuit Heat Sink

This heat sink provides a relatively large surface area for cooling and can be employed with a wide variety of material.

In one form, microcircuit substrate 20 having conductive lands 22 is drilled to include one or more openings 24. A semiconductor or chip 26 including ball terminals 28 is positioned over opening 24 with terminals 28 in contact with lands
22. A copper pin 29 is coated at one end with a high thermoconductivity grease or paste 30. Pin 29 is inserted in opening 24, the greased end 30 being brought into contact with chip 26. The diameter of pin 29 is less than that of opening 24. The pin 29 length should also be of a length that it is recessed in opening 24 by approximately 10 mils. The bottom of opening 24 is filled with high thermoconductivity silicon grease 32 which makes contact with pin 29 and substrate 20. The pin member conducts heat away from chip 26 with the aid of the relatively large surface area of pin 29. In the event the substrate is ceramic or the like, pin 29 is further aided in removing heat from chip 26.

In the event that the substrate is not a good heat conductor, an extension can be connected to the pin to an external heat sink not shown. The latter serves a purpose similar to that of the ceramic substrate.

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