Browse Prior Art Database

Heat Dissipator Assemblies

IP.com Disclosure Number: IPCOM000093900D
Original Publication Date: 1966-Mar-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 68K

Publishing Venue

IBM

Related People

Mandel, AP: AUTHOR [+3]

Abstract

These dissipator assemblies rapidly remove heat from micro-miniature modules as well as proved environmental protection for planar semiconductor devices or chips forming part of the module.

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Heat Dissipator Assemblies

These dissipator assemblies rapidly remove heat from micro-miniature modules as well as proved environmental protection for planar semiconductor devices or chips forming part of the module.

The arrangement in A comprises a square, electrical-isolating, heat- conductive dielectric substrate 11 such as alumina or beryllia having extending, copper contact pins 12. Conductive pattern 13, printed about the periphery of the substrate surface 14, is joined to outer contact pins 12 to provide electrical paths leading from chips 15. The major heat dissipating collector terminal of chip 15 is soldered directly upon an enlarged portion of pattern 13. The emitter and base terminals are provided with raised contacts 16. These are connected to pattern 13 by overlying copper straps 17 bonded between them.

A heat-conductive, metal base plate 18, such as copper having a stud 19 of similar metal extending upwardly from it, is solder reflowed to tinned pad area 20 on substrate 11. Where the substrate includes inner dummy pins 12, base plate 18 is provided with apertures. These are placed in registry about the tops of inner pins 12. Apertured, finned metal cap 21 of copper, for example, is positioned over stud 19. Sidewalls 22 of cap 21 are in abutting relationship to those of substrate 11. Stud 19 is then joined as by swaging to cap 21. If desired, the bottom surface of substrate 11 can be back-sealed with an electrically-insulating, yieldable substance,...