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Process for Electrolessly Depositing Nickel Iron Phosphorus Magnetic Thin Films

IP.com Disclosure Number: IPCOM000093904D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Koretzky, H: AUTHOR [+2]

Abstract

This process electrolessly deposits crack-free, nonmagnetostrictive thin films. These contain from about 65 to 85% by weight nickel, from about 15 to 35% by weight iron, and from about 0.25 to about 2% by weight phosphorus.

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Process for Electrolessly Depositing Nickel Iron Phosphorus Magnetic Thin Films

This process electrolessly deposits crack-free, nonmagnetostrictive thin films. These contain from about 65 to 85% by weight nickel, from about 15 to 35% by weight iron, and from about 0.25 to about 2% by weight phosphorus.

A plurality of conductive elements 2, which are to receive the electroless deposit, are spaced along bar 4 in electroless plating cell 10. Bar 4 is held in place by support members 6 mounted along the side walls of cell 10. Electroless solution 8 is covered with a layer of xylene 16 in order to retard oxidation of solution 8. Supporting ring 18 suspends cell 10 in vat 12 containing a constant temperature bath. Heating coils 14 are mounted about vat 12 for maintaining solution 8 at the desired reaction temperature.

Solution 8 is an aqueous solution containing water-soluble salts of nickel and iron, a reductant such as hypophosphite ions in a concentration sufficient to permit the chemical reduction of the nickel and iron salts, tartrate ions which are the complexing and sequestering agents, and sufficient ammonium molecules to form the nickel hexamine complex ion in solution. As between the nickel and iron, the nickel cations are the major constituent in the solution.

With elements 2 in place and the xylene protective layer 16 superimposed thereover, solution 8 is brought up to temperature to initiate the electroless plating reaction. Magnetic anisotropy is induced...