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Probe for Testing Memory Plane

IP.com Disclosure Number: IPCOM000093913D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 54K

Publishing Venue

IBM

Related People

Smith, JF: AUTHOR

Abstract

The probe provides simultaneous test connections to three adjacent array lines in an evaporated film memory plane. The upper drawing shows the test probe in perspective, viewed from its underside. The lower drawing shows the probe seated on the edge of a memory plane P undergoing test.

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Probe for Testing Memory Plane

The probe provides simultaneous test connections to three adjacent array lines in an evaporated film memory plane. The upper drawing shows the test probe in perspective, viewed from its underside. The lower drawing shows the probe seated on the edge of a memory plane P undergoing test.

Body 1 of brass or similar material serves as a mount for three RF connectors 2, only one of which is shown, that are respectively connected to three printed circuit conductors 3 on the lower face of a transparent, insulating, contact pad 4 secured to the underside of body 1. The soldered joints between connectors 2 and their respective conductors 3 hold pad 4 in place. Angled recess 5 provides clearance between these soldered joints and ground substrate 6 of plane P. Transparent plastic nosepiece 7 secured to the front edge of body 1 overlies the front portion of pad 4 and is grooved in its lower face to receive resilient insert or cushion 8. The latter applies pressure to pad 4 when the probe is mounted on plane P. Good contact between conductors 3 and the corresponding array lines is thus insured.

The mounting includes bearing block 9 secured to body 1 and slidably mounted on guide rod 10 extending between removable brackets 11 for enabling the probe to be positioned anywhere along one edge of plane P. Conductors 3 are aligned visually with the selected array lines by sighting through nosepiece 7 and pad 4. Pressure screw 12 applies contact pressur...