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Browse Prior Art Database

Additive Multilayer Circuit

IP.com Disclosure Number: IPCOM000093914D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

Haddad, MM: AUTHOR

Abstract

Module 1, having mounted on its surface components 2 and conductors 3, has a dielectric insulator 4. The latter covers components 2 and certain portions of conductors 3. Module 1 is attached to dielectric card 5 by adhesive layer 6. Modules 1 are electrically connected to card 5 by electroplated layer 8, applied by conventional electroplating techniques.

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Additive Multilayer Circuit

Module 1, having mounted on its surface components 2 and conductors 3, has a dielectric insulator 4. The latter covers components 2 and certain portions of conductors 3. Module 1 is attached to dielectric card 5 by adhesive layer 6. Modules 1 are electrically connected to card 5 by electroplated layer 8, applied by conventional electroplating techniques.

Multilayer card 5 is fabricated by a series of additive steps. The additive process begins by applying a thick photosensitive dielectric layer 9 to copper foil base 10. Layer 9 is then exposed to light through an appropriate mask pattern and developed. The sensitized areas of layer 9 are then washed away. Interconnections 11 are made to base layer 10 by conventional electroplating procedures.

A second photosensitive layer 12 is then applied, exposed through the desired mask pattern and developed. The first internal conductor 13 is then deposited by conventional techniques in those portions of layer 12 which are removed. In a similar manner, subsequent photosensitive dielectric layers 14, 15 and 16 are applied, exposed and developed. Following each of these developing steps, layers of conductive metal are electroplated in those spaces of the photosensitive layers that are removed.

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