Browse Prior Art Database

Multilayer Printed Circuit Board Connections

IP.com Disclosure Number: IPCOM000093924D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 52K

Publishing Venue

IBM

Related People

Byrnes, HP: AUTHOR

Abstract

The drawing indicates four methods for establishing an electrical connection between an outer conductive layer and one or more other conductive layers of a multilayer printed circuit board PC. Each method involves forming a cylindrical plug 1, at the desired circuit location, and either displacing the plug one layer or removing it from PC.

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Multilayer Printed Circuit Board Connections

The drawing indicates four methods for establishing an electrical connection between an outer conductive layer and one or more other conductive layers of a multilayer printed circuit board PC. Each method involves forming a cylindrical plug 1, at the desired circuit location, and either displacing the plug one layer or removing it from PC.

In PC 1, plug 1 is formed, as by punching, and is displaced one layer to provide a recess which is partially filled by reflow soldering. Such provides a solder connection 2, connecting the upper and middle layers U and M. The lower layer L of PC is soldered to the middle layer of plug 1. If desired, the lower end of plug 1 can be cut off to present a relatively flat surface free from the projections that are otherwise present.

In PC 2 and in PC 3, terminal pin 4 is driven part way into the board to form plug 1 and displace it one layer. In PC 2, pin 4 is soldered to upper layer U and layer M is mechanically connected to the pin. In PC 3, pin 4 mechanically connects layers U and M. Such mechanical connections are formed as a result of driving pin 4 into the board so that the forming forces distort and stress the layers to thus force the layers into conductive contact with pin 4.

In PC 4, the plug is removed, A preform 5 is fitted into the hole from which the plug was removed. Connections 6 and 7 are made by reflow soldering. Preform 5 can be conductive or nonconductive. In cases where...