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Making Decal Interconnections to Semiconductors and Substrates

IP.com Disclosure Number: IPCOM000093944D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 61K

Publishing Venue

IBM

Related People

Chiou, C: AUTHOR [+2]

Abstract

This method is for making interconnections to planar mounted chips. The method has efficient thermal dissipation, excellent metallurgical compatibility between the interconnections and chip, good repairability, highly reliable joints, excellent reproducibility. The terminals provide high corrosion resistance.

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Making Decal Interconnections to Semiconductors and Substrates

This method is for making interconnections to planar mounted chips. The method has efficient thermal dissipation, excellent metallurgical compatibility between the interconnections and chip, good repairability, highly reliable joints, excellent reproducibility. The terminals provide high corrosion resistance.

A.001 inch thick film or decal 20 includes a plurality of. 0005 inch thick pure gold interconnections 22. The latter are aligned with contacts 24 of a semiconductor chip 26, typically a monolithic circuit, and lands 27 of a substrate assembly 30. Decal 20 is suitably clamped to substrate assembly 30 by a clamp assembly 28 included in hot stage 32. The temperature of the entire assembly is raised to approximately 320 degree C.

Thermocompression bonder 34 comprises a plurality of tips 36 adjustable in X, Y, and Z directions. Each tip 36 is associated with a pneumatic piston 38. Bonder 34 is superimposed over decal 20 to engage each tip 36 with an individual contact in decal 20. A predetermined air pressure is applied to each pneumatic piston 28. Adjustable tips 36 compress interconnections 22 to chip contacts 24. Then, tips 36 are relocated to compress interconnections 22 to lands 27. A thermocompression bond is established between gold interconnections 22 and the chip contact or land. Decal 20 is stripped leaving interconnections 22 in a form of a bridge between lands 27 and contacts 24, as shown...