Browse Prior Art Database

Wafer Package

IP.com Disclosure Number: IPCOM000093996D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 48K

Publishing Venue

IBM

Related People

Hershoff, L: AUTHOR

Abstract

This package is for holding individual, fragile wafers, such as silicon wafer 10, in order to minimize contact with the surface of the wafer and to provide shock mounting of the wafer. There are two pairs of similar flexible bowed plastic strips 11 with centralized stepped notching 12 and 13. The notching provides an elevated and centralized opening in which a wafer 10 is poised on four outer short strip shoulders. Such is without any contact with the central portion of the face of wafer 10 containing the circuitry. Bowed strips 11 are flexed in place from the four corners of a small hinged plastic box 14. The two hinged parts of the box are of equal depth and receptive to bowed strips 11 of equal width, and are of a length sufficient to make opposite bowed strips abut at the center and become self-locking.

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Wafer Package

This package is for holding individual, fragile wafers, such as silicon wafer 10, in order to minimize contact with the surface of the wafer and to provide shock mounting of the wafer. There are two pairs of similar flexible bowed plastic strips 11 with centralized stepped notching 12 and 13. The notching provides an elevated and centralized opening in which a wafer 10 is poised on four outer short strip shoulders. Such is without any contact with the central portion of the face of wafer 10 containing the circuitry.

Bowed strips 11 are flexed in place from the four corners of a small hinged plastic box 14. The two hinged parts of the box are of equal depth and receptive to bowed strips 11 of equal width, and are of a length sufficient to make opposite bowed strips abut at the center and become self-locking. Strips 11 can be notched to different widths, top 12 and bottom 13, so that by reversal of their position, different size individual wafers can be held by the same parts.

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