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Polyimide Separating Film

IP.com Disclosure Number: IPCOM000094022D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 47K

Publishing Venue

IBM

Related People

Schiller, JM: AUTHOR

Abstract

The use of polyimide material as a separating film results in stronger multilayer structures with smoother, nonoxidized outer surfaces.

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Polyimide Separating Film

The use of polyimide material as a separating film results in stronger multilayer structures with smoother, nonoxidized outer surfaces.

In fabricating a multilayer structure the individual laminas or layers 11 such as copper foil are stacked in a predetermined order. Epoxy glass sheets 12 or their equivalent, cut to the size of each lamina or smaller, are placed between adjacent surfaces of individual laminas, to act as an insulating material and to aid in bonding.

Prior to placement between the platens 13 of a compression mold, the stack to be laminated is sandwiched between separating films 14. This assures a uniform transmission of pressure from the platens to the stack and prevents bonding material sticking to the platens.

The sandwiched stack is placed between platens 13 and subjected to elevated heat and pressure for a period of time long enough to bond the layers into an integral structure 15. Platens 13 are then cooled to room temperature and moved apart to relieve pressure. Laminate 15 is removed and the separating films 14 are peeled.

When a polyimide material is used for the separating film, the film acts as a superior barrier to oxidation, notwithstanding that its oxygen permeability is much higher than previously used materials. The resulting laminate 15 is much stronger owing to the high bonding temperatures permitted as a result of the polyimide's high-temperature capability. In addition, the outer surfaces of laminate 15...