Browse Prior Art Database

Counter Flow Cooling System

IP.com Disclosure Number: IPCOM000094023D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 71K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR

Abstract

This cooling arrangement for high-heat-generating electronic modules utilizes counterflow of the air and the liquid coolant. Modules 11 are convectively cooled by air flowing upwardly between serpentine fins 13. The air loses its heat conductively to cold plate 15. This transfers the heat to liquid in tubes 17. The latter are bonded to the plate with a bond 19 giving good heat transfer.

This text was extracted from a PDF file.
At least one non-text object (such as an image or picture) has been suppressed.
This is the abbreviated version, containing approximately 100% of the total text.

Page 1 of 2

Counter Flow Cooling System

This cooling arrangement for high-heat-generating electronic modules utilizes counterflow of the air and the liquid coolant. Modules 11 are convectively cooled by air flowing upwardly between serpentine fins 13. The air loses its heat conductively to cold plate 15. This transfers the heat to liquid in tubes 17. The latter are bonded to the plate with a bond 19 giving good heat transfer.

1

Page 2 of 2

2

[This page contains 3 pictures or other non-text objects]