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Circuit Chip Packaging Using Egg Crate

IP.com Disclosure Number: IPCOM000094024D
Original Publication Date: 1966-Apr-01
Included in the Prior Art Database: 2005-Mar-06
Document File: 2 page(s) / 43K

Publishing Venue

IBM

Related People

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Abstract

This module mounting arrangement includes an X-shaped, aluminum extrusion heat sink 11. The latter is centrally mounted within one of compartments or squares 13 of a printed circuit egg-crate structure 15. Modules 17 having circuits are mounted in heat conductive relation to the heat absorbing arms of heat sink 11. Curved spring contacts 19 project from the outer ends of each module 17. When heat sink 11 is rotated clockwise, the four contacts 19 electrically engage the four printed circuit contacts 21 on the egg-crate walls. Suitable printed circuit lines 23, corner connections 25 between perpendicular walls and plated-through-holes 27 are combined to provide vertical and horizontal circuits to any other part of the egg-crate structure. This arrangement with heat sinks 11 provides ample space for air cooling.

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Circuit Chip Packaging Using Egg Crate

This module mounting arrangement includes an X-shaped, aluminum extrusion heat sink 11. The latter is centrally mounted within one of compartments or squares 13 of a printed circuit egg-crate structure 15. Modules 17 having circuits are mounted in heat conductive relation to the heat absorbing arms of heat sink 11. Curved spring contacts 19 project from the outer ends of each module 17. When heat sink 11 is rotated clockwise, the four contacts 19 electrically engage the four printed circuit contacts 21 on the egg-crate walls. Suitable printed circuit lines 23, corner connections 25 between perpendicular walls and plated-through-holes 27 are combined to provide vertical and horizontal circuits to any other part of the egg-crate structure. This arrangement with heat sinks 11 provides ample space for air cooling. Also, the egg-crate arrangement minimizes the circuit line length between any two modules.

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